Invention Grant
- Patent Title: Multi-chip semiconductor package and method of fabricating the same
- Patent Title (中): 多芯片半导体封装及其制造方法
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Application No.: US13618041Application Date: 2012-09-14
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Publication No.: US08772084B2Publication Date: 2014-07-08
- Inventor: Jong-Gi Lee , Kwang-Yong Lee , Min-Ho Lee
- Applicant: Jong-Gi Lee , Kwang-Yong Lee , Min-Ho Lee
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Stanzione & Kim, LLP
- Priority: KR10-2011-0095948 20110922
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/02
Abstract:
A first semiconductor chip having a first projection electrode formed on an upper surface thereof is prepared. A second semiconductor chip having a second projection electrode is mounted on the first semiconductor chip to expose the first projection electrode. An insulating film is formed between the first projection electrode and the second projection electrode. A groove is formed in the insulating film. An interconnection configured to fill an inside of the groove and connected to the first projection electrode and the second projection electrode is formed.
Public/Granted literature
- US20130078763A1 MULTI-CHIP SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME Public/Granted day:2013-03-28
Information query
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