Invention Grant
US08772097B2 Method for fabricating a field effect transistor, and field effect transistor
有权
用于制造场效应晶体管的方法和场效应晶体管
- Patent Title: Method for fabricating a field effect transistor, and field effect transistor
- Patent Title (中): 用于制造场效应晶体管的方法和场效应晶体管
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Application No.: US11559572Application Date: 2006-11-14
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Publication No.: US08772097B2Publication Date: 2014-07-08
- Inventor: Luis-Felipe Giles , Frank Lau , Rainer Liebmann
- Applicant: Luis-Felipe Giles , Frank Lau , Rainer Liebmann
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Schiff Hardin LLP
- Priority: DE102005054219 20051114
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/8234

Abstract:
In a method for fabricating a field effect transistor, a first source/drain region and a second source/drain region are formed in a substrate. A channel region is formed between the first source/drain region and the second source/drain region. A gate region is formed on the channel region. Micro-cavities are formed in the substrate at least below the channel region, and the micro-cavities are oxidized.
Public/Granted literature
- US20070117296A1 METHOD FOR FABRICATING A FIELD EFFECT TRANSISTOR, AND FIELD EFFECT TRANSISTOR Public/Granted day:2007-05-24
Information query
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