Invention Grant
- Patent Title: Method for manufacturing semiconductor chips from a semiconductor wafer
- Patent Title (中): 从半导体晶片制造半导体芯片的方法
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Application No.: US13783529Application Date: 2013-03-04
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Publication No.: US08772134B2Publication Date: 2014-07-08
- Inventor: Vincent Jarry , Patrick Hougron , Dominique Touzet , José Mendez
- Applicant: STMicroelectronics (Tours) SAS
- Applicant Address: FR Tours
- Assignee: STMicroelectronics (Tours) SAS
- Current Assignee: STMicroelectronics (Tours) SAS
- Current Assignee Address: FR Tours
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: FR1054472 20100608
- Main IPC: H01L21/66
- IPC: H01L21/66 ; B26D3/00
Abstract:
A method for manufacturing semiconductor chips from a semiconductor wafer, including the steps of: fastening, on a first support frame, a second support frame having outer dimensions smaller than the outer dimensions of the first frame and greater than the inner dimensions of the first frame; arranging the wafer on a surface of a film stretched on the second frame; carrying out wafer processing operations by using equipment capable of receiving the first frame; separating the second frame from the first frame and removing the first frame; and carrying out wafer processing operations by using equipment capable of receiving the second frame.
Public/Granted literature
- US20130178017A1 METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS FROM A SEMICONDUCTOR WAFER Public/Granted day:2013-07-11
Information query
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