Invention Grant
- Patent Title: High voltage light emitting diode chip and its manufacturing method
- Patent Title (中): 高压发光二极管芯片及其制造方法
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Application No.: US13465077Application Date: 2012-05-07
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Publication No.: US08772138B2Publication Date: 2014-07-08
- Inventor: Chih-Wei Yang , Ching-Hwa Chang Jen
- Applicant: Chih-Wei Yang , Ching-Hwa Chang Jen
- Applicant Address: TW Yangmei
- Assignee: Walsin Lihwa Corporation
- Current Assignee: Walsin Lihwa Corporation
- Current Assignee Address: TW Yangmei
- Agency: Grossman, Tucker, Perreault & Pfleger, PLLC
- Priority: TW101105225A 20120217
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/18

Abstract:
A high voltage light emitting diode chip and its manufacturing method are provided. The high voltage light emitting diode chip can be manufactured by forming a plurality of light emitting diode units on a substrate and electrically connecting the light emitting diode units, wherein a trench with a width of about 0.5 μm to about 7 μm is present between every two adjacent light emitting diode units to isolate the light emitting diode units. The procedure for manufacturing the high voltage light emitting diode chip is simple and the high voltage light emitting diode chip that is produced can exhibit satisfying luminous efficiency.
Public/Granted literature
- US20130214297A1 HIGH VOLTAGE LIGHT EMITTING DIODE CHIP AND ITS MANUFACTURING METHOD Public/Granted day:2013-08-22
Information query
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