Invention Grant
- Patent Title: Production method for a unipolar semiconductor component and semiconductor device
- Patent Title (中): 单极半导体元件和半导体器件的制造方法
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Application No.: US13383593Application Date: 2010-07-12
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Publication No.: US08772140B2Publication Date: 2014-07-08
- Inventor: Rudolf Elpelt , Peter Friedrichs
- Applicant: Rudolf Elpelt , Peter Friedrichs
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102009033302 20090715
- International Application: PCT/EP2010/059976 WO 20100712
- International Announcement: WO2011/006866 WO 20110120
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/15

Abstract:
A unipolar semiconductor component having a drift layer is produced by forming the drift layer with a continuously decreasing concentration of a charge carrier doping along the growth direction of the drift layer by way of epitaxial precipitation of the material of the drift layer, which comprises at least one wide band gap material. By using silicon carbide for the drift layer formed by the epitaxial precipitation, a subsequent change of the continuously decreasing concentration of the charge carrier doping due to a diffusion of the dopant atoms in downstream processes is suppressed. The production method can be used in particular to implement a unipolar semiconductor component comprising a drift layer, which component has an advantageous ratio of a comparatively high reverse bias voltage with relatively low forward losses, in a simple and/or cost-effective manner. The unipolar semiconductor component can be an active or passive semiconductor component.
Public/Granted literature
- US20120187419A1 Production Method for a Unipolar Semiconductor Component and Semiconductor Device Public/Granted day:2012-07-26
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