Invention Grant
- Patent Title: Heat stabilized moulding composition
- Patent Title (中): 热稳定成型组合物
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Application No.: US11794334Application Date: 2006-01-09
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Publication No.: US08772397B2Publication Date: 2014-07-08
- Inventor: Pieter Gijsman , Wilhelmus J. M. Sour , Rudy Rulkens , Robert H. C. Janssen
- Applicant: Pieter Gijsman , Wilhelmus J. M. Sour , Rudy Rulkens , Robert H. C. Janssen
- Applicant Address: NL Heerlen
- Assignee: DSM IP Assets B.V.
- Current Assignee: DSM IP Assets B.V.
- Current Assignee Address: NL Heerlen
- Agency: Nixon & Vanderhye P.C.
- Priority: EP05075064 20050112
- International Application: PCT/EP2006/000186 WO 20060109
- International Announcement: WO2006/074912 WO 20060720
- Main IPC: C08K3/08
- IPC: C08K3/08 ; C08L77/00

Abstract:
Non-fibrous-reinforced thermoplastic moulding compositions comprising a metal powder as a heat stabilizer are provided. The metal powder has a weight average particle size (dm) of at most 1 mm and the metal in the metal powder is selected from the group consisting of elementary metals from Group VB, VIB, VIIB and VIIIB of the Periodic Table, and mixtures thereof. A thermoplastic polyamide is also provided with an Mw of at most 50,000 g/mol, or a blend of at least two thermoplastic polymers with Tmelt or Tg differing by at least 20° C., or a second thermostabilizer. The invention also relates to the use of these compositions in high temperature applications.
Public/Granted literature
- US20080146718A1 Heat Stabilized Moulding Composition Public/Granted day:2008-06-19
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