Invention Grant
- Patent Title: Silicone resin, sealing material, and optical semiconductor device
- Patent Title (中): 硅树脂,密封材料和光学半导体器件
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Application No.: US13273664Application Date: 2011-10-14
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Publication No.: US08772430B2Publication Date: 2014-07-08
- Inventor: Haruka Fujii , Hiroyuki Katayama
- Applicant: Haruka Fujii , Hiroyuki Katayama
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-249094 20101105
- Main IPC: C08G77/20
- IPC: C08G77/20

Abstract:
A silicone resin is obtained by allowing a cage octasilsesquioxane having a group represented by formula (1) below, to react with an alkenyl group-containing polysiloxane containing an alkenyl group having a molarity smaller than the molarity of the hydrosilyl group of the cage octasilsesquioxane in the presence of a hydrosilylation catalyst: (where R1 represents a monovalent hydrocarbon group, R2 represents hydrogen or a monovalent hydrocarbon group, and the molar ratio of monovalent hydrocarbon group: hydrogen in R2 in the cage octasilsesquioxane as a whole is, as an average value, in a range of 6.5:1.5 to 5.5:2.5).
Public/Granted literature
- US20120112211A1 SILICONE RESIN, SEALING MATERIAL, AND OPTICAL SEMICONDUCTOR DEVICE Public/Granted day:2012-05-10
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