Invention Grant
- Patent Title: Thermal responsive molecule
- Patent Title (中): 热响应分子
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Application No.: US12950098Application Date: 2010-11-19
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Publication No.: US08772540B2Publication Date: 2014-07-08
- Inventor: Noboru Koga , Satoru Karasawa , Hiroyuki Hayashi
- Applicant: Noboru Koga , Satoru Karasawa , Hiroyuki Hayashi
- Applicant Address: JP Fukuoka-shi
- Assignee: Kyushu University, National University Corporation
- Current Assignee: Kyushu University, National University Corporation
- Current Assignee Address: JP Fukuoka-shi
- Agency: Edwards Wildman Palmer LLP
- Main IPC: C07C275/00
- IPC: C07C275/00

Abstract:
Provided is a thermal responsive molecule favorable as a thermal responsive low-molecular hydrogelling agent or the like that gels in response to heat. The thermal responsive molecule is characterized in that an amphiphilic side chain obtained by bonding a hydrophilic side chain such as triethylene glycol and a hydrophobic group such as an octyl group is introduced into a C3-symmetric disc-shaped molecular skeleton such as 1,3,5-benzenetriyltriurea. For example, the thermal responsive molecule is 1,1′,1″-(benzene-1,3,5-triyl)tris{3-(2,5,8,11-tetraoxaheptadecan-17-yl)urea} or the like.
Public/Granted literature
- US20110124916A1 THERMAL RESPONSIVE MOLECULE Public/Granted day:2011-05-26
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