Invention Grant
US08772658B2 Electrically conductive structure of micro switch 有权
微动开关的导电结构

  • Patent Title: Electrically conductive structure of micro switch
  • Patent Title (中): 微动开关的导电结构
  • Application No.: US13288043
    Application Date: 2011-11-03
  • Publication No.: US08772658B2
    Publication Date: 2014-07-08
  • Inventor: Ching-Hsiung Chu
  • Applicant: Ching-Hsiung Chu
  • Main IPC: H01H1/52
  • IPC: H01H1/52
Electrically conductive structure of micro switch
Abstract:
An electrically conductive structure of a micro switch capable of letting users know about the reciprocal movement of a switch button, comprising a base, having an electrode module installed in a containing groove formed at the top of the base; an axis cylinder slidably installed in the containing groove; a conical sleeve made of a soft high temperature resisting material and disposed between the axis cylinder and the electrode module; a metal conductive bump formed at the top of the conical sleeve and driven by the axis cylinder to compress and release the conical sleeve to connect and disconnect the electrode module, and the axis cylinder moves reciprocally to produce a hand-pressing feeling, and the containing groove has as sheathe made of a soft high temperature resisting material to block external liquid from entering into the containing groove to improve the service life of the switch.
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