Invention Grant
- Patent Title: Dual gas laser cutting of medical devices
- Patent Title (中): 双气体激光切割医疗器械
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Application No.: US13544322Application Date: 2012-07-09
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Publication No.: US08772670B2Publication Date: 2014-07-08
- Inventor: Jeffrey W. Baxter , David Mackiewicz
- Applicant: Jeffrey W. Baxter , David Mackiewicz
- Applicant Address: US CA Santa Clara
- Assignee: Abbott Cardiovascular Systems Inc.
- Current Assignee: Abbott Cardiovascular Systems Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fulwider Patton LLP
- Main IPC: B23K26/14
- IPC: B23K26/14 ; B23K26/38 ; B23K26/08 ; B23K26/42 ; A61F2/91

Abstract:
A system prevents oxidation of a laser cut workpiece by utilizing a laser source that utilizes laser source with an inert gas, such as argon or helium, rather than air or oxygen, to create the slots or kerfs which form the pattern cut into the workpiece. The system introduces oxygen gas through the workpiece as it is being laser cut to oxidize any slag or dross created during the laser cutting process. Oxygen or a mixture of oxygen with other gases cools the slag and the workpiece while at the same time oxidizing the slag to either completely burn or partial burn the slag before it strikes an exposed surface of the tubular member.
Public/Granted literature
- US20120273467A1 DUAL GAS LASER CUTTING OF MEDICAL DEVICES Public/Granted day:2012-11-01
Information query
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