Invention Grant
- Patent Title: Precision laser ablation
- Patent Title (中): 精密激光烧蚀
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Application No.: US13112575Application Date: 2011-05-20
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Publication No.: US08772671B2Publication Date: 2014-07-08
- Inventor: Sergey V. Broude , Chen-Hsiung Cheng , Pascal Miller , Glenn Ogura , David L. Wall
- Applicant: Sergey V. Broude , Chen-Hsiung Cheng , Pascal Miller , Glenn Ogura , David L. Wall
- Applicant Address: US NH Nashua
- Assignee: Resonetics, LLC
- Current Assignee: Resonetics, LLC
- Current Assignee Address: US NH Nashua
- Agency: Mintz, Levin, Cohn, Ferris, Glovsky and Popeo, P.C.
- Main IPC: B23K26/06
- IPC: B23K26/06 ; B23K26/36 ; B23K26/03 ; B23K26/40

Abstract:
Methods and systems for precisely removing selected layers of materials from a multi-layer work piece using laser ablation are disclosed. Precise removal of one or more selected layers of materials of a work piece may be performed by irradiating at least one location on a multi-layer work piece with a laser beam, ablating material at the at least one location, detecting one or more characteristics of the material ablated at the at least one location and analyzing the one or more characteristics to identify a change in at least one of the one or more characteristics that indicates a change in the type of material being ablated. Related systems are also described.
Public/Granted literature
- US20120000893A1 Precision Laser Ablation Public/Granted day:2012-01-05
Information query
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