Invention Grant
US08772794B2 Light emitting device package having LED disposed in leadframe cavities
有权
发光器件封装,其LED布置在引线框腔中
- Patent Title: Light emitting device package having LED disposed in leadframe cavities
- Patent Title (中): 发光器件封装,其LED布置在引线框腔中
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Application No.: US13325326Application Date: 2011-12-14
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Publication No.: US08772794B2Publication Date: 2014-07-08
- Inventor: Buemyeon Lee
- Applicant: Buemyeon Lee
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates LLP
- Priority: KR10-2011-0076250 20110729
- Main IPC: H01L29/18
- IPC: H01L29/18

Abstract:
Disclosed are a light emitting device package and a lighting system in which the light emitting device package includes a first cavity in a first region of the body, a second cavity in a second region of the body, first and second lead frames spaced apart from each other in the first cavity, a third lead frame spaced apart from the second lead frame in the second cavity, a first light emitting device on the first and second lead frames in the first cavity, a second light emitting device on the second and third lead frames in the second cavity, and a molding member in the first and second cavities.
Public/Granted literature
- US20130062632A1 LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM INCLUDING THE SAME Public/Granted day:2013-03-14
Information query
IPC分类: