Invention Grant
US08772794B2 Light emitting device package having LED disposed in leadframe cavities 有权
发光器件封装,其LED布置在引线框腔中

  • Patent Title: Light emitting device package having LED disposed in leadframe cavities
  • Patent Title (中): 发光器件封装,其LED布置在引线框腔中
  • Application No.: US13325326
    Application Date: 2011-12-14
  • Publication No.: US08772794B2
    Publication Date: 2014-07-08
  • Inventor: Buemyeon Lee
  • Applicant: Buemyeon Lee
  • Applicant Address: KR Seoul
  • Assignee: LG Innotek Co., Ltd.
  • Current Assignee: LG Innotek Co., Ltd.
  • Current Assignee Address: KR Seoul
  • Agency: Ked & Associates LLP
  • Priority: KR10-2011-0076250 20110729
  • Main IPC: H01L29/18
  • IPC: H01L29/18
Light emitting device package having LED disposed in leadframe cavities
Abstract:
Disclosed are a light emitting device package and a lighting system in which the light emitting device package includes a first cavity in a first region of the body, a second cavity in a second region of the body, first and second lead frames spaced apart from each other in the first cavity, a third lead frame spaced apart from the second lead frame in the second cavity, a first light emitting device on the first and second lead frames in the first cavity, a second light emitting device on the second and third lead frames in the second cavity, and a molding member in the first and second cavities.
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