Invention Grant
- Patent Title: Panel and method for fabricating the same
- Patent Title (中): 面板及其制造方法
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Application No.: US13483005Application Date: 2012-05-29
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Publication No.: US08772796B2Publication Date: 2014-07-08
- Inventor: Kuo-Yu Huang , Te-Chun Huang
- Applicant: Kuo-Yu Huang , Te-Chun Huang
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: AU Optronics Corp.
- Current Assignee: AU Optronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Priority: TW100149961A 20111230
- Main IPC: H01L29/18
- IPC: H01L29/18 ; H01L27/12 ; H01L27/15
Abstract:
A panel is disclosed, in which, a patterned semiconductor layer is formed on an insulation layer. The patterned semiconductor layer includes a portion corresponding to an electrode and another portion corresponding to a wiring trace. The portion corresponding to the electrode may be formed as, for example, a channel, and the other portion corresponding to the wiring trace may protect the wiring trace during fabrication process or in the structure from scratching or corrosion.
Public/Granted literature
- US20130168704A1 Panel and method for fabricating the same Public/Granted day:2013-07-04
Information query
IPC分类:
