Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13042519Application Date: 2011-03-08
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Publication No.: US08772836B2Publication Date: 2014-07-08
- Inventor: Osamu Machida
- Applicant: Osamu Machida
- Applicant Address: JP Niiza-Shi
- Assignee: Sanken Electric Co., Ltd.
- Current Assignee: Sanken Electric Co., Ltd.
- Current Assignee Address: JP Niiza-Shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2010-073269 20100326
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
To provide a semiconductor device in which a rectifying element capable of reducing a leak current in reverse bias when a high voltage is applied and reducing a forward voltage drop Vf and a transistor element are integrally formed on a single substrate.A semiconductor device has a transistor element and a rectifying element on a single substrate. The transistor element has an active layer formed on the substrate and three electrodes (source electrode, drain electrode, and gate electrode) disposed on the active layer. The rectifying element has an anode electrode disposed on the active layer, a cathode electrode which is the drain electrode, and a first auxiliary electrode between the anode electrode and cathode electrode.
Public/Granted literature
- US20110233615A1 SEMICONDUCTOR DEVICE Public/Granted day:2011-09-29
Information query
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