Invention Grant
- Patent Title: Semiconductor device including resistor and method of fabricating the same
- Patent Title (中): 包括电阻的半导体器件及其制造方法
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Application No.: US12882436Application Date: 2010-09-15
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Publication No.: US08772855B2Publication Date: 2014-07-08
- Inventor: Yoonmoon Park , Keonsoo Kim , Jinhyun Shin , Jae-Hwang Sim
- Applicant: Yoonmoon Park , Keonsoo Kim , Jinhyun Shin , Jae-Hwang Sim
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2009-0087064 20090915
- Main IPC: H01L29/788
- IPC: H01L29/788

Abstract:
Embodiments of a semiconductor device including a resistor and a method of fabricating the same are provided. The semiconductor device includes a mold pattern disposed on a semiconductor substrate to define a trench, a resistance pattern including a body region and first and second contact regions, wherein the body region covers the bottom and sidewalls of the trench, the first and second contact regions extend from the extending from the body region over upper surfaces of the mold pattern, respectively; and first and second lines contacting the first and second contact regions, respectively.
Public/Granted literature
- US20110062508A1 SEMICONDUCTOR DEVICE INCLUDING RESISTOR AND METHOD OF FABRICATING THE SAME Public/Granted day:2011-03-17
Information query
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