Invention Grant
- Patent Title: Superjunction structures for power devices and methods of manufacture
- Patent Title (中): 功率器件的超结构和制造方法
-
Application No.: US13095670Application Date: 2011-04-27
-
Publication No.: US08772868B2Publication Date: 2014-07-08
- Inventor: Joseph A. Yedinak , Mark L. Rinehimer , Praveen Muraleedharan Shenoy , Hamza Yilmaz , James Pan , Rodney S. Ridley, Sr.
- Applicant: Joseph A. Yedinak , Mark L. Rinehimer , Praveen Muraleedharan Shenoy , Hamza Yilmaz , James Pan , Rodney S. Ridley, Sr.
- Applicant Address: US CA San Jose
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A power device includes a semiconductor substrate having a plurality of alternately arranged pillars of first and second conductivity types. At least one of the plurality of pillars of second conductivity type includes a first trench epitaxial layer of the second conductivity type disposed on a trench sidewall of the second trench and a trench bottom surface of the second trench, a second trench epitaxial layer of the second conductivity type disposed on the first trench epitaxial layer of the second conductivity type, and an insulating material layer disposed on the second trench epitaxial layer of the second conductivity type.
Public/Granted literature
- US20120273875A1 Superjunction Structures for Power Devices and Methods of Manufacture Public/Granted day:2012-11-01
Information query
IPC分类: