Invention Grant
- Patent Title: Electronic device
- Patent Title (中): 电子设备
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Application No.: US12974166Application Date: 2010-12-21
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Publication No.: US08772912B2Publication Date: 2014-07-08
- Inventor: Shotaro Miyawaki , Katsuhiko Kawashima , Atsushi Kashiwazaki , Takashi Yoshimizu
- Applicant: Shotaro Miyawaki , Katsuhiko Kawashima , Atsushi Kashiwazaki , Takashi Yoshimizu
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2010-014663 20100126
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/50 ; H01L23/31 ; H01L23/00 ; H01L23/433
Abstract:
An electronic device includes a heat sink, a substrate mounted on the heat sink, a coating layer formed on the substrate, a lead frame fixed to the heat sink, and a mold resin sealing the substrate and the lead frame. The coating layer is made of one of a polyimide-based resin and a polyamideimide-based resin. The lead frame has a fixing terminal fixed to the heat sink through an adhesive layer. The adhesive layer is made of the same material as the coating layer.
Public/Granted literature
- US20110180915A1 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-07-28
Information query
IPC分类:
