Invention Grant
- Patent Title: Forming in-situ micro-feature structures with coreless packages
- Patent Title (中): 形成具有无芯包装的原位微特征结构
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Application No.: US13852277Application Date: 2013-03-28
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Publication No.: US08772924B2Publication Date: 2014-07-08
- Inventor: Ravi Nalla , Mathew J. Manusharow
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- Main IPC: H01L21/02
- IPC: H01L21/02
Abstract:
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a die to a carrier material, forming dielectric material surrounding the die, forming buildup layers in the dielectric material to form a coreless bumpless buildup package structure, and patterning the carrier material to form microchannel structures on the package structure.
Public/Granted literature
- US20130214403A1 FORMING IN-SITU MICRO-FEATURE STRUCTURES WITH CORELESS PACKAGES Public/Granted day:2013-08-22
Information query
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