Invention Grant
US08772925B2 Bonding structure and bonding method of heat diffusion member, and cooling unit using the same
有权
散热构件的接合结构和接合方法，以及使用其的冷却单元
- Patent Title: Bonding structure and bonding method of heat diffusion member, and cooling unit using the same
- Patent Title (中): 散热构件的接合结构和接合方法，以及使用其的冷却单元
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Application No.: US13325423Application Date: 2011-12-14
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Publication No.: US08772925B2Publication Date: 2014-07-08
- Inventor: Koji Noda , Satoshi Sakimichi , Masahiro Sakamoto , Kimio Kohara
- Applicant: Koji Noda , Satoshi Sakimichi , Masahiro Sakamoto , Kimio Kohara
- Applicant Address: JP Kariya JP Nishio
- Assignee: DENSO CORPORATION,Nippon Soken, Inc.
- Current Assignee: DENSO CORPORATION,Nippon Soken, Inc.
- Current Assignee Address: JP Kariya JP Nishio
- Agency: Harness, Dickey & Pierce, PLC
- Priority: JP2010-280815 20101216; JP2011-153181 20110711
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L23/34 ; H01L23/36 ; H01L23/367
Abstract:
A bonding structure includes a first member, a second member and a bonding member. The first member has a plate shape and is made of a carbon-base material. The first member serves as a heat diffusion member that transfers heat at least in a thickness direction, which is perpendicular to a plane of the plate shape. The second member is bonded to the first member through the bonding member. The first member has a metal thin film at least on an opposed surface that is opposed to the second member. The bonding member is disposed between the opposed surface of the first member and the second member. The bonding member is provided by a sintered body of metal particle. For example, the bonding structure is employed in a cooling unit including a heat source.
Public/Granted literature
- US20120152510A1 BONDING STRUCTURE AND BONDING METHOD OF HEAT DIFFUSION MEMBER, AND COOLING UNIT USING THE SAME Public/Granted day:2012-06-21
Information query
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