Invention Grant
- Patent Title: Integrated circuit chip with reduced IR drop
- Patent Title (中): 集成电路芯片具有降低的IR降
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Application No.: US13205648Application Date: 2011-08-09
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Publication No.: US08772928B2Publication Date: 2014-07-08
- Inventor: Chih-Ching Lin , Ya-Ting Chang , Chia-Lin Chuang
- Applicant: Chih-Ching Lin , Ya-Ting Chang , Chia-Lin Chuang
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: Mediatek Inc.
- Current Assignee: Mediatek Inc.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
An integrated circuit chip includes a power/ground interconnection network in a topmost metal layer over a semiconductor substrate and at least a bump pad on/over the power/ground interconnection network. The power/ground mesh interconnection network includes a first power/ground line connected to the bump pad and extending along a first direction, and a connection portion connected to the bump pad and extending along a second direction.
Public/Granted literature
- US20130037934A1 INTEGRATED CIRCUIT CHIP WITH REDUCED IR DROP Public/Granted day:2013-02-14
Information query
IPC分类:
