Invention Grant
- Patent Title: Dual-function integrated circuit
- Patent Title (中): 双功能集成电路
-
Application No.: US13551476Application Date: 2012-07-17
-
Publication No.: US08772931B2Publication Date: 2014-07-08
- Inventor: François Tailliet
- Applicant: François Tailliet
- Applicant Address: FR Rousset
- Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee Address: FR Rousset
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: FR1156674 20110722
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H03K19/173
Abstract:
An electronic circuit in a package, including two functions, the package orientation activating a single one of the two functions.
Public/Granted literature
- US20130021093A1 DUAL-FUNCTION INTEGRATED CIRCUIT Public/Granted day:2013-01-24
Information query
IPC分类:
