Invention Grant
- Patent Title: Method for manufacturing a layer arrangement, and a layer arrangement
- Patent Title (中): 层布置的制造方法和层布置
-
Application No.: US13598672Application Date: 2012-08-30
-
Publication No.: US08772948B2Publication Date: 2014-07-08
- Inventor: Gopalakrishnan Trichy Rengarajan , Christian Fachmann
- Applicant: Gopalakrishnan Trichy Rengarajan , Christian Fachmann
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L31/0232
- IPC: H01L31/0232
Abstract:
A method for manufacturing a layer arrangement in accordance with various embodiments may include: providing a first layer having a side; forming one or more nanoholes in the first layer that are open towards the side of the first layer; depositing a second layer over the side of the first layer.
Public/Granted literature
- US20140061935A1 METHOD FOR MANUFACTURING A LAYER ARRANGEMENT, AND A LAYER ARRANGEMENT Public/Granted day:2014-03-06
Information query
IPC分类:
