Invention Grant
US08772952B2 Semiconductor device with copper wire having different width portions
有权
具有不同宽度部分的铜线的半导体器件
- Patent Title: Semiconductor device with copper wire having different width portions
- Patent Title (中): 具有不同宽度部分的铜线的半导体器件
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Application No.: US12889023Application Date: 2010-09-23
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Publication No.: US08772952B2Publication Date: 2014-07-08
- Inventor: Masatoshi Yasunaga , Hironori Matsushima , Kenya Hironaga , Soshi Kuroda
- Applicant: Masatoshi Yasunaga , Hironori Matsushima , Kenya Hironaga , Soshi Kuroda
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: McDermott Will & Emery LLP
- Priority: JP2009-221116 20090925
- Main IPC: H01L29/40
- IPC: H01L29/40
Abstract:
To improve reliability of a semiconductor device in which wire bonding using a wire made of copper is performed. A semiconductor device is configured so that one of end parts (wide width part) of a copper wire is joined via a bump on a pad (electrode pad) formed over a main surface (first main surface) of a semiconductor chip of the semiconductor device. The bump is made of gold, which is a metal material having a hardness lower than that of copper, and the width of the bump is narrower than the width of the wide width part of the wire.
Public/Granted literature
- US20110074019A1 SEMICONDUCTOR DEVICE Public/Granted day:2011-03-31
Information query
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