Invention Grant
- Patent Title: Signal amplification by hierarchal resonating structures
- Patent Title (中): 通过层级谐振结构的信号放大
-
Application No.: US12681428Application Date: 2007-10-11
-
Publication No.: US08772999B2Publication Date: 2014-07-08
- Inventor: Pritiraj Mohanty , Alexei Gaidarzhy , Guiti Zolfagharkhani , Fardad Hashemi
- Applicant: Pritiraj Mohanty , Alexei Gaidarzhy , Guiti Zolfagharkhani , Fardad Hashemi
- Applicant Address: US MA Cambridge
- Assignee: Sand 9, Inc.
- Current Assignee: Sand 9, Inc.
- Current Assignee Address: US MA Cambridge
- Agency: Wolf, Greenfield & Sacks, P.C.
- International Application: PCT/US2007/081040 WO 20071011
- International Announcement: WO2009/048468 WO 20090416
- Main IPC: H02N1/00
- IPC: H02N1/00 ; H03B5/30

Abstract:
An electromechanical resonating structure, including: first level major elements coupled to each other to form a second or higher level hierarchy; and first level sub-micron size minor elements with a characteristic frequency and coupled to each of the first level major elements to form a second level hierarchy in which a signal is effectively amplified by vibrating each of the plurality of major elements in at least one mode determined by the geometry and dimensions of the first level sub-micron minor elements.
Public/Granted literature
- US20110121682A1 SIGNAL AMPLIFICATION BY HIERARCHAL RESONATING STRUCTURES Public/Granted day:2011-05-26
Information query