Invention Grant
US08772999B2 Signal amplification by hierarchal resonating structures 有权
通过层级谐振结构的信号放大

Signal amplification by hierarchal resonating structures
Abstract:
An electromechanical resonating structure, including: first level major elements coupled to each other to form a second or higher level hierarchy; and first level sub-micron size minor elements with a characteristic frequency and coupled to each of the first level major elements to form a second level hierarchy in which a signal is effectively amplified by vibrating each of the plurality of major elements in at least one mode determined by the geometry and dimensions of the first level sub-micron minor elements.
Public/Granted literature
Information query
Patent Agency Ranking
0/0