Invention Grant
- Patent Title: Method of inspecting printed circuit board, method of manufacturing printed circuit board and inspection device of printed circuit board
- Patent Title (中): 检查印刷电路板的方法，印刷电路板的制造方法和印刷电路板的检查装置
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Application No.: US12908984Application Date: 2010-10-21
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Publication No.: US08773159B2Publication Date: 2014-07-08
- Inventor: Kousuke Murakami , Yoshihiro Toyoda
- Applicant: Kousuke Murakami , Yoshihiro Toyoda
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JP2009-246674 20091027
- Main IPC: G01R31/28
- IPC: G01R31/28
Abstract:
A plurality of assembly sheets are placed on an upper surface of a substrate adsorption platform, and a pressing plate is placed on the plurality of assembly sheets placed on the substrate adsorption platform such that the plurality of assembly sheets are pressed by the pressing plate. In this state, a DC power supply device is turned on and causes the upper surface of the substrate adsorption platform to be charged, thereby causing the plurality of assembly sheets to be adsorbed on the upper surface by an electrostatic force. Then, the pressing plate placed on the plurality of assembly sheets is removed while the upper surface of the substrate adsorption platform is charged, and automatic appearance inspection is performed on the plurality of assembly sheets adsorbed on the upper surface of the substrate adsorption platform.
Public/Granted literature
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