Invention Grant
- Patent Title: Saw device, saw oscillator, and electronic apparatus
- Patent Title (中): 锯设备，锯片振荡器和电子设备
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Application No.: US13557748Application Date: 2012-07-25
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Publication No.: US08773214B2Publication Date: 2014-07-08
- Inventor: Kunihito Yamanaka , Naohisa Obata
- Applicant: Kunihito Yamanaka , Naohisa Obata
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2011-165798 20110728
- Main IPC: H03B5/30
- IPC: H03B5/30
Abstract:
A SAW device includes a SAW chip formed of a piezoelectric substrate and an IDT formed thereon, a base substrate that supports the SAW chip, and a fixing member that fixes the SAW chip to the base substrate. The SAW chip that forms a cantilever is supported by the base substrate via the fixing member in a position where the IDT does not overlap with the fixing member in a plan view of the SAW chip. The length W of the SAW chip in a y-axis direction and the length D of the fixing member in the y-axis direction satisfy 1
Public/Granted literature
- US20130027144A1 SAW DEVICE, SAW OSCILLATOR, AND ELECTRONIC APPARATUS Public/Granted day:2013-01-31
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