Invention Grant
- Patent Title: Radio frequency front end module and multi band module using the radio frequency front end module
- Patent Title (中): 射频前端模块和多频段模块采用射频前端模块
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Application No.: US12818249Application Date: 2010-06-18
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Publication No.: US08773220B2Publication Date: 2014-07-08
- Inventor: Chul Soo Kim , Jun Chul Kim , Dong Su Kim , In Sang Song , Duck Hwan Kim , Yun Kwon Park , Jea Shik Shin
- Applicant: Chul Soo Kim , Jun Chul Kim , Dong Su Kim , In Sang Song , Duck Hwan Kim , Yun Kwon Park , Jea Shik Shin
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2009-0054378 20090618
- Main IPC: H01P5/12
- IPC: H01P5/12
Abstract:
Disclosed are a radio frequency (RF) front end module and a multi-band communication module using the RF front end module. The RF front end module may use a plurality of bandpass filters and at least one diplexer being connected to at least one of front ends or rear ends of two bandpass filters of the plurality of bandpass filters.
Public/Granted literature
- US20100321130A1 RADIO FREQUENCY FRONT END MODULE AND MULTI BAND MODULE USING THE RADIO FREQUENCY FRONT END MODULE Public/Granted day:2010-12-23
Information query
