When a wafer on a fine movement stage supported by a coarse movement stage is exposed via a projection optical system with an illumination light at an exposure station, a position of the fine movement stage within an XY plane is measured with good precision by a measurement system. Further, when an alignment to a wafer on a fine movement stage supported by a coarse movement stage is performed at a measurement station, a position of the fine movement stage within an XY plane is measured with good precision by a measurement system.