Invention Grant
- Patent Title: Fan mounting apparatus for heat dissipation
- Patent Title (中): 散热风扇安装装置
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Application No.: US13400710Application Date: 2012-02-21
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Publication No.: US08773853B2Publication Date: 2014-07-08
- Inventor: Lung-Sheng Tsai , Yao-Chung Chen
- Applicant: Lung-Sheng Tsai , Yao-Chung Chen
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: TW100120678 20110614
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A mounting apparatus includes a securing plate and a fan. The securing plate defines an engaging slot and a retaining slot. The fan includes a first sidewall attached to the securing plate. The first sidewall includes a first engaging member and a second engaging member. The first engaging member engages in the engaging slot, to prevent the fan from moving in a first direction substantially parallel to the securing plate. The second engaging member extends through the retaining slot from the front of the securing plate to the back of the securing plate, and engages with the securing plate, to prevent the fan from moving in a second direction substantially perpendicular to the securing plate.
Public/Granted literature
- US20120318953A1 FAN MOUNTING APPARATUS FOR HEAT DISSIPATION Public/Granted day:2012-12-20
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