Invention Grant
- Patent Title: Terminal mounting construction and electronic device
- Patent Title (中): 端子安装结构和电子设备
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Application No.: US13358841Application Date: 2012-01-26
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Publication No.: US08773863B2Publication Date: 2014-07-08
- Inventor: Takayuki Ikeda
- Applicant: Takayuki Ikeda
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-015982 20110128
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
A terminal mounting construction includes a housing and a terminal. The housing accommodates a substrate and including a locking portion. The terminal connects the substrate to an electric wire. The terminal includes a conductive portion, a substrate connecting terminal portion, a wire connecting portion and a locked portion. The conductive portion is connected to a pattern on the substrate. The substrate connecting terminal portion holds the substrate together with the conductive portion. The wire connecting portion is connected to the electric wire from an opposite direction to an inserting direction in which the substrate is inserted between the conductive portion and the substrate connecting terminal portion. The locked portion is locked in the locking portion. The housing includes an accommodating portion accommodating the substrate connecting terminal portion so as to receive an end face of the substrate connecting terminal portion which faces to follow the opposite direction.
Public/Granted literature
- US20120195014A1 TERMINAL MOUNTING CONSTRUCTION AND ELECTRONIC DEVICE Public/Granted day:2012-08-02
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