Invention Grant
US08774426B2 Signal processing apparatus, semiconductor chip, signal processing system, and method of processing signal
有权
信号处理装置,半导体芯片,信号处理系统及信号处理方法
- Patent Title: Signal processing apparatus, semiconductor chip, signal processing system, and method of processing signal
- Patent Title (中): 信号处理装置,半导体芯片,信号处理系统及信号处理方法
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Application No.: US13172013Application Date: 2011-06-29
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Publication No.: US08774426B2Publication Date: 2014-07-08
- Inventor: Masanori Inazumi , Naotaka Saito
- Applicant: Masanori Inazumi , Naotaka Saito
- Applicant Address: JP Yokohama
- Assignee: Lapis Semiconductor Co., Ltd.
- Current Assignee: Lapis Semiconductor Co., Ltd.
- Current Assignee Address: JP Yokohama
- Agency: Kubotera & Associates, LLC
- Priority: JP2010-162179 20100716
- Main IPC: H03G3/00
- IPC: H03G3/00 ; H03G9/00 ; H04B15/00 ; H03G5/16

Abstract:
In a signal processing apparatus, a high frequency level detecting unit detects a level of a high frequency component adjusted with a first adjusting unit, and a first control unit controls a first gain of the adjusting unit according to the level of the high frequency component thus detected. Further, a low frequency level detecting unit detects a level of a low frequency component adjusted with a second adjusting unit. A second control unit controls a second gain according to the level of the high frequency component and the level of the low frequency component thus adjusted, so that a difference between the level of the high frequency component adjusted with the first adjusting unit and the level of the low frequency component adjusted with the second adjusting unit becomes smaller than a specific level determined in advance.
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