Invention Grant
- Patent Title: Headphone
- Patent Title (中): 耳机
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Application No.: US13614439Application Date: 2012-09-13
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Publication No.: US08774441B2Publication Date: 2014-07-08
- Inventor: Takayuki Miyazawa
- Applicant: Takayuki Miyazawa
- Applicant Address: JP Yokohama-Shi, Kanagawa
- Assignee: JVC Kenwood Corporation
- Current Assignee: JVC Kenwood Corporation
- Current Assignee Address: JP Yokohama-Shi, Kanagawa
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2011-217180 20110930; JP2011-217184 20110930; JP2011-217204 20110930
- Main IPC: H04R21/02
- IPC: H04R21/02

Abstract:
A headphone includes: a housing, a hanger, and a bracket accommodated in the housing. The hanger includes: a connecting portion formed in a ring-shape; and a pair of engagement portions opposite to each other in a radial direction of the connecting portion and supports the housing unit to allow the housing unit to rotate. The bracket includes: a flexible curved base; and a pair of protrusions protruding at both ends of the base portion in directions away from each other on an axis penetrating the both ends. The housing includes a pair of through holes at positions corresponding to the pair of engagement portions. The pair of protrusions is rotatably engaged with the pair of engagement portions through the pair of through holes.
Public/Granted literature
- US20130083955A1 HEADPHONE Public/Granted day:2013-04-04
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