Invention Grant
- Patent Title: Vented in-the-ear headphone
- Patent Title (中): 通风耳机耳机
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Application No.: US13453874Application Date: 2012-04-23
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Publication No.: US08774444B2Publication Date: 2014-07-08
- Inventor: Victor M. Tiscareno , Kurt R. Stiehl
- Applicant: Victor M. Tiscareno , Kurt R. Stiehl
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H04R1/10
- IPC: H04R1/10

Abstract:
A vented tip for in-the-ear headphones has a core portion to be mounted to a sound output tube of an in-the-ear earphone and a flange portion extending outward from and surrounding the core portion. The vented tip has a) an outer portion formed in the flange portion that is to be in contact with, and thereby form a seal with, a user's ear canal, and b) an inner portion spaced inwards from the outer portion to thereby not form the seal with the user's ear canal. The inner portion has a calibrated perforation or hole formed therein. Other embodiments that may help reduce bone conduction effects are also described and claimed.
Public/Granted literature
- US20120207337A1 VENTED IN-THE-EAR HEADPHONE Public/Granted day:2012-08-16
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