Invention Grant
- Patent Title: Ultra high density pin-compatible four-channel enhanced small form-factor pluggable module
- Patent Title (中): 超高密度引脚兼容四通道增强型小型可插拔模块
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Application No.: US13418521Application Date: 2012-03-13
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Publication No.: US08774639B2Publication Date: 2014-07-08
- Inventor: Norman Tang , Liang Ping Peng , David Lai , Anthony Nguyen
- Applicant: Norman Tang , Liang Ping Peng , David Lai , Anthony Nguyen
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Edell, Shapiro & Finnan, LLC
- Main IPC: H04B10/00
- IPC: H04B10/00
Abstract:
An enhanced small form-factor pluggable (SFP+) transceiver module and an SFP+ host port are provided. The enhanced SFP+ transceiver module receives a reception data signal at a data rate of 40 gigabits per second (40G). The reception data signal is sent to a transceiver bidirectional transmission unit. The transceiver bidirectional transmission unit comprises a first SFP+ connector unit configured to interface with a second SFP+ connector unit of an SFP+ host port. The reception data signal is sent from the transceiver bidirectional transmission unit to the second SFP+ connector unit of the SFP+ host port via the first SFP+ connector unit.
Public/Granted literature
- US20130243438A1 Ultra High Density Pin-Compatible Four-Channel Enhanced Small Form-Factor Pluggable Module Public/Granted day:2013-09-19
Information query
