Invention Grant
- Patent Title: Thermal ground plane for cooling a computer
- Patent Title (中): 用于冷却电脑的热接地平面
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Application No.: US12550090Application Date: 2009-08-28
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Publication No.: US08776868B2Publication Date: 2014-07-15
- Inventor: Yves Martin , Theodore G. Van Kessel
- Applicant: Yves Martin , Theodore G. Van Kessel
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Michael J. Buchenhorner; Vazken Alexanian
- Main IPC: F28F7/00
- IPC: F28F7/00

Abstract:
A cooling device for cooling a computer includes: a flexible and conformal fluid heat-exchanger coupled to a surface of the computer; a liquid coolant material circulated through the fluid heat-exchanger to convey heat from the fluid to an external cooling apparatus; an enclosure defined when the fluid heat-exchanger is placed against the computer surface; and a vacuum applied to the enclosure, removably sealing the fluid heat-exchanger to the computer to provide a vapor seal for the enclosure.
Public/Granted literature
- US20110048672A1 THERMAL GROUND PLANE FOR COOLING A COMPUTER Public/Granted day:2011-03-03
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