Invention Grant
- Patent Title: Image-assisted system for adjusting a bonding tool
- Patent Title (中): 用于调整粘合工具的图像辅助系统
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Application No.: US13451622Application Date: 2012-04-20
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Publication No.: US08777086B2Publication Date: 2014-07-15
- Inventor: Jiang Wen Deng , Hei Lam Chang , Tim Wai Mak
- Applicant: Jiang Wen Deng , Hei Lam Chang , Tim Wai Mak
- Applicant Address: SG Singapore
- Assignee: ASM Technology Singapore Pte. Ltd.
- Current Assignee: ASM Technology Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Sughrue Mion, PLLC
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K37/00
Abstract:
A bonding tool is adjusted to a desired operational position by viewing the bonding tool with an image-capturing device and displaying an image of the bonding tool as viewed by the image-capturing device onto a display screen. A corresponding image of a reference bonding tool showing the desired operational position of the bonding tool is superimposed onto the display screen and the position of the bonding tool is adjusted with an adjustment mechanism until the bonding tool as viewed by the image-capturing device is aligned with the superimposed image of the reference bonding tool.
Public/Granted literature
- US20130277413A1 IMAGE-ASSISTED SYSTEM FOR ADJUSTING A BONDING TOOL Public/Granted day:2013-10-24
Information query
IPC分类:
