Invention Grant
- Patent Title: Hydronic radiant flooring heating system
- Patent Title (中): 水力辐射地板采暖系统
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Application No.: US11404963Application Date: 2006-04-15
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Publication No.: US08777120B2Publication Date: 2014-07-15
- Inventor: Todd W. Bates
- Applicant: Todd W. Bates
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Steven Bennett
- Main IPC: F24D5/10
- IPC: F24D5/10

Abstract:
A hydronic radiant flooring heating system includes a pipe having pipe sections, and a grid of a thermally conductive material. The pipe sections are arranged substantially parallel to one another along a first axis, where there is a second axis perpendicular to the first axis. The pipe is to carry a heated liquid to radiantly heat a flooring under which the pipe is situated. The grid is situated relative to the sections. A portion of the grid is positioned substantially parallel to the second axis, and has an increased gauge to provide for lateral heat flow from the sections along the second axis. Heating of the flooring under which the pipe and the grid are situated is substantially uniform at least partially due to the increased gauge of the portion of the grid positioned substantially parallel to the second axis, while permitting wider spacing between adjacent of the pipe sections.
Public/Granted literature
- US20070257124A1 Hydronic radiant flooring heating system Public/Granted day:2007-11-08
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