Invention Grant
- Patent Title: Unpacking device for glass substrate
- Patent Title (中): 玻璃基板开封装置
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Application No.: US13518860Application Date: 2012-05-24
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Publication No.: US08777286B2Publication Date: 2014-07-15
- Inventor: Minghu Qi , Chun Hao Wu , Kun Hsien Lin , Yongqiang Wang , XiandeGuo Li , Zhenhua Guo
- Applicant: Minghu Qi , Chun Hao Wu , Kun Hsien Lin , Yongqiang Wang , XiandeGuo Li , Zhenhua Guo
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee Address: CN Shenzhen, Guangdong
- Agent Andrew C. Cheng
- International Application: PCT/CN2012/075981 WO 20120524
- International Announcement: WO2013/159418 WO 20131031
- Main IPC: B25J15/06
- IPC: B25J15/06
Abstract:
The present invention provides an unpacking device for glass substrate and which includes a bracket and a plurality of sucking heads mounted thereon. A plurality of altitude sensors is incorporated to trigger an alarm if the altitude sensors are not synchronized during the pickup operation.
Public/Granted literature
- US20130285402A1 Unpacking Device for Glass Substrate Public/Granted day:2013-10-31
Information query
