Invention Grant
US08777376B2 Skewed nozzle arrays on ejection chips for micro-fluid applications
失效
用于微流体应用的排出芯片上的倾斜喷嘴阵列
- Patent Title: Skewed nozzle arrays on ejection chips for micro-fluid applications
- Patent Title (中): 用于微流体应用的排出芯片上的倾斜喷嘴阵列
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Application No.: US12788446Application Date: 2010-05-27
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Publication No.: US08777376B2Publication Date: 2014-07-15
- Inventor: Frank Edward Anderson , Richard Earl Corley , Jiandong Fang
- Applicant: Frank Edward Anderson , Richard Earl Corley , Jiandong Fang
- Applicant Address: JP Osaka
- Assignee: Funai Electric Co., Ltd.
- Current Assignee: Funai Electric Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Amster, Rothstein & Ebenstein LLP
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged along skewed fluid vias to enable seamless stitching of fluid ejections. The firing elements are energized to eject fluid and ones are spaced according to colors or fluid types. Overlapping firing elements serve redundancy efforts during imaging for reliable print quality. Variable chips sizes and shapes are disclosed as are relationships between differently colored fluid vias. Skew angles range variously each with noted advantages. Singulating chips from larger wafers provide still further embodiments.
Public/Granted literature
- US20110292122A1 SKEWED NOZZLE ARRAYS ON EJECTION CHIPS FOR MICRO-FLUID APPLICATIONS Public/Granted day:2011-12-01
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