Invention Grant
US08777607B2 Mold including a locking device 有权
模具包括锁定装置

  • Patent Title: Mold including a locking device
  • Patent Title (中): 模具包括锁定装置
  • Application No.: US12747973
    Application Date: 2008-12-15
  • Publication No.: US08777607B2
    Publication Date: 2014-07-15
  • Inventor: Sébastien Godde
  • Applicant: Sébastien Godde
  • Applicant Address: FR
  • Assignee: Compose SAS
  • Current Assignee: Compose SAS
  • Current Assignee Address: FR
  • Agency: Quarles & Brady LLP
  • Priority: EP07305001 20071214
  • International Application: PCT/EP2008/067566 WO 20081215
  • International Announcement: WO2009/077508 WO 20090625
  • Main IPC: B29C33/20
  • IPC: B29C33/20
Mold including a locking device
Abstract:
The invention relates to a mold (1) for molding, in particular by injection, that comprises two half-molds (2, 3) each defined by a side surface (21, 31), a front face and a rear face. One at least of said two half-molds is to be associated with means for opening and closing the mold. The two half-molds can be brought into contact at the level of a junction plane (1) when the mold is in the closed position. The mold is characterized in that one half-mold is provided with a locking device (6) that comprises: at least one latch (7) that can be simultaneously housed in a recess (25) in each half-mold (2, 3); and at least one independent system (8) capable of bringing together or separating the latch (7) and the recesses (25, 35) in which the latch (7) is to be received, and including one or more jack(s) (8) including a chamber connected to the half-mold, a piston capable of movement in said chamber, and a rod connected to the piston and to which the latch is attached.
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