Invention Grant
- Patent Title: Conical sponge brush for cleaning semiconductor wafers
- Patent Title (中): 用于清洁半导体晶圆的锥形海绵刷
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Application No.: US13803211Application Date: 2013-03-14
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Publication No.: US08778087B2Publication Date: 2014-07-15
- Inventor: Jeffrey J. Tyrrell , Bradley S. Withers
- Applicant: Illinois Tool Works Inc.
- Applicant Address: US IL Glenview
- Assignee: Illinois Tool Works Inc.
- Current Assignee: Illinois Tool Works Inc.
- Current Assignee Address: US IL Glenview
- Agency: Klintworth & Rozenblat IP LLC
- Main IPC: B08B7/00
- IPC: B08B7/00

Abstract:
A cleaning device for cleaning a substrate is provided. In one aspect, the cleaning device includes a brush including a first end, a second end opposed to the first end, an outer surface, and a hollow bore defined in the brush about a central axis of the brush. The brush defines a first cross-sectional area near the first end and a second cross-sectional area near the second end. Both the first and second cross-sectional areas are generally perpendicular to the central axis and the second cross-sectional area is greater than the first cross-sectional area.
Public/Granted literature
- US20130255720A1 CONICAL SPONGE BRUSH FOR CLEANING SEMICONDUCTOR WAFERS Public/Granted day:2013-10-03
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