Invention Grant
US08778087B2 Conical sponge brush for cleaning semiconductor wafers 有权
用于清洁半导体晶圆的锥形海绵刷

Conical sponge brush for cleaning semiconductor wafers
Abstract:
A cleaning device for cleaning a substrate is provided. In one aspect, the cleaning device includes a brush including a first end, a second end opposed to the first end, an outer surface, and a hollow bore defined in the brush about a central axis of the brush. The brush defines a first cross-sectional area near the first end and a second cross-sectional area near the second end. Both the first and second cross-sectional areas are generally perpendicular to the central axis and the second cross-sectional area is greater than the first cross-sectional area.
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