Invention Grant
- Patent Title: Method for making three-dimensional liquid crystal polymer multilayer circuit boards
- Patent Title (中): 制备三维液晶聚合物多层电路板的方法
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Application No.: US12016060Application Date: 2008-01-17
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Publication No.: US08778124B2Publication Date: 2014-07-15
- Inventor: Louis Joseph Rendek, Jr. , Lawrence Wayne Shacklette , Philip Anthony Marvin
- Applicant: Louis Joseph Rendek, Jr. , Lawrence Wayne Shacklette , Philip Anthony Marvin
- Applicant Address: US FL Melbourne
- Assignee: Harris Corporation
- Current Assignee: Harris Corporation
- Current Assignee Address: US FL Melbourne
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Main IPC: B32B37/00
- IPC: B32B37/00

Abstract:
A method is for making a non-planar three-dimensional (3D) multilayered circuit board. The method may include forming a stacked arrangement including at least one pair of liquid crystal polymer (LCP) layers with a bonding layer therebetween. The stacked arrangement may further include at least one electrically conductive pattern layer on at least one of the LCP layers. The method may further include heating and applying pressure to the stacked arrangement to shape the stacked arrangement into a non-planar 3D shape and concurrently causing the bonding layer to bond together the adjacent LCP layers of the stacked arrangement to thereby form the non-planar 3D multi-layered circuit board.
Public/Granted literature
- US20090183829A1 METHOD FOR MAKING THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTILAYER CIRCUIT BOARDS Public/Granted day:2009-07-23
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