Invention Grant
- Patent Title: Tunable polish rates by varying dissolved oxygen content
- Patent Title (中): 通过改变溶解氧含量可调波兰率
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Application No.: US13118975Application Date: 2011-05-31
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Publication No.: US08778203B2Publication Date: 2014-07-15
- Inventor: P. R. Veera Dandu , Naresh K. Penta , Babu V. Suryadevara , Uma Rames Krishna Lagudu
- Applicant: P. R. Veera Dandu , Naresh K. Penta , Babu V. Suryadevara , Uma Rames Krishna Lagudu
- Applicant Address: US NY Potsdam
- Assignee: Clarkson University
- Current Assignee: Clarkson University
- Current Assignee Address: US NY Potsdam
- Agency: Bond Schoeneck & King, PLLC
- Agent George R. McGuire; Blaine T. Bettinger
- Main IPC: B24B37/00
- IPC: B24B37/00 ; B24B57/00
Abstract:
A method and system for tunable removal rates and selectivity of materials during chemical-mechanical polishing using a chemical slurry or solution with increased dissolved oxygen content. The slurry can optionally include additives to improve removal rate and/or selectivity. Further selectivity can be obtained by varying the concentration and type of abrasives in the slurry, using lower operating pressure, using different pads, or using other additives in the dispersion at specific pH values.
Public/Granted literature
- US20110294404A1 Tunable Polish Rates By Varying Dissolved Oxygen Content Public/Granted day:2011-12-01
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