When local heating by use of laser sealing or the like is applied, the bonding strength between glass substrates and a sealing layer is improved to provide an electronic device having increased reliability. An electronic device includes a first glass substrate, a second glass substrate, and a sealing layer to seal an electronic element portion disposed between these glass substrates. The sealing layer is a layer obtained by locally heating a sealing material by an electromagnetic wave, such as laser light or infrared light, to melt-bond the sealing material, the sealing material containing sealing glass, a low-expansion filler and an electromagnetic wave absorber. In the first and second glass substrates, each reacted layer is produced to have a maximum depth of at least 30 nm from an interface with the sealing layer.