Invention Grant
- Patent Title: Electronic circuit
- Patent Title (中): 电子电路
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Application No.: US13387421Application Date: 2010-06-17
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Publication No.: US08779298B2Publication Date: 2014-07-15
- Inventor: Richard Asterland
- Applicant: Richard Asterland
- Applicant Address: CH Plan-les-Ouates
- Assignee: St-Ericsson SA
- Current Assignee: St-Ericsson SA
- Current Assignee Address: CH Plan-les-Ouates
- Agency: Patent Portfolio Builders PLLC
- Priority: EP09166986 20090731
- International Application: PCT/EP2010/058530 WO 20100617
- International Announcement: WO2011/012372 WO 20110203
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
Electronic circuits (1, 101) are disclosed. The electronic circuits comprise a first and a second integrated circuit (10a, 110a, 10b, 110b) and a printed circuit board (PCB) (15, 115). The PCB comprises dielectric layers (30a-c, 130) of polymer-based materials having different dissipation factors arranged in accordance with various embodiments for suppressing noise.
Public/Granted literature
- US20120184326A1 Electronic Circuit Public/Granted day:2012-07-19
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