Invention Grant
US08780317B2 Film forming method, film forming device, liquid crystal arrangement method, liquid crystal arrangement device, liquid crystal device, liquid crystal device production method and electronic equipment 失效
成膜方法,成膜装置,液晶布置方法,液晶布置装置,液晶装置,液晶装置的生产方法和电子设备

  • Patent Title: Film forming method, film forming device, liquid crystal arrangement method, liquid crystal arrangement device, liquid crystal device, liquid crystal device production method and electronic equipment
  • Patent Title (中): 成膜方法,成膜装置,液晶布置方法,液晶布置装置,液晶装置,液晶装置的生产方法和电子设备
  • Application No.: US12356738
    Application Date: 2009-01-21
  • Publication No.: US08780317B2
    Publication Date: 2014-07-15
  • Inventor: Kei Hiruma
  • Applicant: Kei Hiruma
  • Applicant Address: JP
  • Assignee: Seiko Epson Corporation
  • Current Assignee: Seiko Epson Corporation
  • Current Assignee Address: JP
  • Agency: Harness, Dickey & Pierce, P.L.C.
  • Priority: JP2003-067006 20030312; JP2003-067007 20030312; JP2004-033600 20040210
  • Main IPC: G02F1/1341
  • IPC: G02F1/1341
Film forming method, film forming device, liquid crystal arrangement method, liquid crystal arrangement device, liquid crystal device, liquid crystal device production method and electronic equipment
Abstract:
A film forming device forms a coated film on a substrate by discharging a liquid material in the form of liquid droplets, and causing the liquid droplets to impact on the substrate at a predetermined pitch. The predetermined pitch is determined based on the diameter of the liquid droplets after impact of the liquid droplets on the substrate. Drop marks are reduced and a uniform coated film is formed on the substrate.
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