Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US13082258Application Date: 2011-04-07
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Publication No.: US08780575B2Publication Date: 2014-07-15
- Inventor: Chih-Yung Chia
- Applicant: Chih-Yung Chia
- Applicant Address: TW New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW New Taipei
- Agency: Brinks Gilson & Lione
- Priority: TW99110883A 20100408
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/02 ; H05K1/11 ; H05K3/00 ; H05K3/28
Abstract:
A printed circuit board includes a board body having a routing-limited area. The routing-limited area is provided with at least one solder pad that is adapted for supporting a metal support thereon. Preferably, the printed circuit board further includes a protrusion block disposed on the solder pad, and having a height greater than that of a signal trace that passes the routing-limited area.
Public/Granted literature
- US20110247868A1 PRINTED CIRCUIT BOARD Public/Granted day:2011-10-13
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