Invention Grant
US08781783B2 System and method for checking ground vias of a controller chip of a printed circuit board
失效
用于检查印刷电路板的控制器芯片的接地孔的系统和方法
- Patent Title: System and method for checking ground vias of a controller chip of a printed circuit board
- Patent Title (中): 用于检查印刷电路板的控制器芯片的接地孔的系统和方法
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Application No.: US12700747Application Date: 2010-02-05
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Publication No.: US08781783B2Publication Date: 2014-07-15
- Inventor: Hsien-Chuan Liang , Shen-Chun Li , Chun-Jen Chen , Shou-Kuo Hsu , Yung-Chieh Chen , Wen-Laing Tseng
- Applicant: Hsien-Chuan Liang , Shen-Chun Li , Chun-Jen Chen , Shou-Kuo Hsu , Yung-Chieh Chen , Wen-Laing Tseng
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN200910309064 20091029
- Main IPC: G01R31/00
- IPC: G01R31/00
Abstract:
A system and method for checking a ground via of control chips of a printed circuit board (PCB) provides a graphical user interface (GUI) displaying a layout of the PCB. The control chip has a plurality of ground pins. The computer searches for signal path routing of each ground pin and ground vias along each signal path routing of each ground pin. If there are any ground vias having the same absolute coordinates, the computer determines that the ground vias are shared by more than one ground pin.
Public/Granted literature
- US20110106481A1 SYSTEM AND METHOD FOR CHECKING GROUND VIAS OF A CONTROLLER CHIP OF A PRINTED CIRCUIT BOARD Public/Granted day:2011-05-05
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