Invention Grant
- Patent Title: Protective cover for a flexible printed circuit board
- Patent Title (中): 柔性印刷电路板的保护盖
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Application No.: US13124710Application Date: 2009-10-09
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Publication No.: US08785783B2Publication Date: 2014-07-22
- Inventor: Klaus Scharrer , Tilo Liebl , Matthias Wieczorek , Alexander Wenk , Hans-Juergen Haering , Juergen Henniger , Karl-Heinz Baumann
- Applicant: Klaus Scharrer , Tilo Liebl , Matthias Wieczorek , Alexander Wenk , Juergen Henniger , Karl-Heinz Baumann , Barbara Haering
- Applicant Address: DE Nuremberg DE Weinheim DE Wiggensbach
- Assignee: Conti Temic microelectronic GmbH,Carl Freudenberg KG,Swoboda KG
- Current Assignee: Conti Temic microelectronic GmbH,Carl Freudenberg KG,Swoboda KG
- Current Assignee Address: DE Nuremberg DE Weinheim DE Wiggensbach
- Agent W. F. Fasse
- Priority: DE102008052243 20081018
- International Application: PCT/DE2009/001410 WO 20091009
- International Announcement: WO2010/043204 WO 20100422
- Main IPC: H05K1/03
- IPC: H05K1/03
Abstract:
A protective cover for mounting a flexible printed circuit board in a protected manner, includes a protective unit for covering a surface of the flexible printed circuit board and a connecting unit for securely connecting a reinforcing plate to the protective cover.
Public/Granted literature
- US20120067622A1 Protective Cover For A Flexible Printed Circuit Board Public/Granted day:2012-03-22
Information query
