Invention Grant
- Patent Title: Electronic module with improved latch mechanism
- Patent Title (中): 具有改进的闩锁机构的电子模块
-
Application No.: US13405599Application Date: 2012-02-27
-
Publication No.: US08787025B2Publication Date: 2014-07-22
- Inventor: Jerry Wu
- Applicant: Jerry Wu
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agent Ming Chieh Chang; Wei Te Chung
- Priority: CN201110046801 20110225
- Main IPC: H05K1/14
- IPC: H05K1/14

Abstract:
An electronic module for mating with a complementary connector, comprises: a housing, a printed circuit board disposed in the housing, a slider member movably received in the channel, a cover member confining the slider member to the housing, a gasket mounted to the housing and having a pair of engaging portions, and an ejector located above on the slider member. The slider member has a body portion and a pair of arm portions extending forwardly from the body portion. The ejector is located above the pair of arm portions, and has a pair of cantilever portions pivotable outward, in response to a sliding movement of the slider member, against the pair of engaging portions.
Public/Granted literature
- US20120218720A1 ELECTRONIC MODULE WITH IMPROVED LATCH MECHANISM Public/Granted day:2012-08-30
Information query