Invention Grant
US08787025B2 Electronic module with improved latch mechanism 有权
具有改进的闩锁机构的电子模块

  • Patent Title: Electronic module with improved latch mechanism
  • Patent Title (中): 具有改进的闩锁机构的电子模块
  • Application No.: US13405599
    Application Date: 2012-02-27
  • Publication No.: US08787025B2
    Publication Date: 2014-07-22
  • Inventor: Jerry Wu
  • Applicant: Jerry Wu
  • Applicant Address: TW New Taipei
  • Assignee: Hon Hai Precision Industry Co., Ltd.
  • Current Assignee: Hon Hai Precision Industry Co., Ltd.
  • Current Assignee Address: TW New Taipei
  • Agent Ming Chieh Chang; Wei Te Chung
  • Priority: CN201110046801 20110225
  • Main IPC: H05K1/14
  • IPC: H05K1/14
Electronic module with improved latch mechanism
Abstract:
An electronic module for mating with a complementary connector, comprises: a housing, a printed circuit board disposed in the housing, a slider member movably received in the channel, a cover member confining the slider member to the housing, a gasket mounted to the housing and having a pair of engaging portions, and an ejector located above on the slider member. The slider member has a body portion and a pair of arm portions extending forwardly from the body portion. The ejector is located above the pair of arm portions, and has a pair of cantilever portions pivotable outward, in response to a sliding movement of the slider member, against the pair of engaging portions.
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